Airbus Defence and Space and Greenerwave announce the strengthening of their strategic partnership with the signing of two additional contracts with a total value of several million euros.
Rohde & Schwarz and LITEON collaborate to showcase a production-optimized test setup for high-throughput multi-device testing at MWC Barcelona 2026.
Amphenol Printed Circuits (APC) will be attending and exhibiting at the American Physical Society’s APS Global Physics Summit 2026, March 15-20, 2026 in Denver, Colo.
Samtec’s rugged high-density, high performance interconnects and alignment products were selected for the VITA 90 standard for use on both the plug-in module (PIM) and the backplane enabling a SWaP alternative to 3U OpenVPX.