Industry News Latest

RFMW Signs Global Distribution Agreement with RFHIC for GaN-Based RF and Microwave Components

News from Everything RF

1 month 3 weeks ago

RFMW, a global distributor of RF, microwave, and power components, has announced a global distribution agreement with RFHIC, a compound semiconductor company specializing in high-power GaN-based RF a..

Sushma
Nuvotronics to Showcase RF and mmWave Technologies for SATCOM and Defense Applications at IMS 2026

News from Everything RF

1 month 3 weeks ago

Nuvotronics will be at IMS 2026, taking place from June 9–11 in Boston, Massachusetts, where the company plans to present a range of RF and mmWave technologies designed for satellite communicat..

Husnain Nawaz
Keysight to Showcase RF, AI, Quantum, and 6G Technologies at IMS 2026

News from Everything RF

1 month 3 weeks ago

Keysight Technologies will showcase a wide range of RF design, emulation, and validation technologies during the 2026 IEEE MTT-S International Microwave Symposium (IMS), taking place from June 7 to J..

Husnain Nawaz
Rohde & Schwarz to Showcase its Latest RF Test Instrumentation Solutions at IMS 2026

News from Everything RF

1 month 3 weeks ago

At the International Microwave Symposium (IMS 2026) in Boston, Rohde & Schwarz will present its newest test instrumentation. IMS 2026 is the world’s premier RF and microwave conference, bri..

Kasyap Suresh
Q versus Bandwidth Chalktalk

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1 month 3 weeks ago

RF Mentor Videos
CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware

Microwave Journal Magazine

1 month 3 weeks ago

CEA-Leti announced a major milestone in the evolution of 3D integration for HPC, advanced smart-vision systems and AI, demonstrating a functional test vehicle utilizing D2W hybrid bonding with pitches down to 1 μm. The findings were presented at the ECTC 2026.
Cetecom Advanced Certifies Rohde & Schwarz Test Solution for Hybrid and Next-Generation eCall Testing

Microwave Journal Magazine

1 month 3 weeks ago

Rohde & Schwarz has successfully passed certification testing of its hybrid eCall and Next Generation eCall test solution conducted by cetecom advanced.
Qorvo’s New High-Isolation Switches Reduce Complexity in Multi-Band Radio Designs

News from Everything RF

1 month 3 weeks ago

Qorvo, a leading global provider of connectivity and power solutions, has announced a new family of RF switches designed to simplify multi-band radio architectures. Spanning 50 MHz to 10 GHz, the fam..

Kasyap Suresh
MOSIS 2.0 Developer Workshop to Showcase Advanced Semiconductor Prototyping & IC Design at IMS 2026

News from Everything RF

1 month 3 weeks ago

MOSIS 2.0, a USC-led semiconductor prototyping initiative/ecosystem, will host its MOSIS 2.0 Developer Workshop during IMS 2026 in Boston, highlighting semiconductor prototyping, fabrication access, ..

Kasyap Suresh
Pickering to Demonstrate Scalable Switching Solutions and a Design Tool for Faster RF Test Development at IMS 2026

News from Everything RF

1 month 3 weeks ago

Pickering Interfaces is going to exhibit its range of RF and microwave signal switching solutions at IMS 2026, from June 9–11 at booth 14104. IMS 2026 is the world’s premier RF and microw..

Shivangi

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Industry News Latest

RFMW Signs Global Distribution Agreement with RFHIC for GaN-Based RF and Microwave Components

Nuvotronics to Showcase RF and mmWave Technologies for SATCOM and Defense Applications at IMS 2026

Keysight to Showcase RF, AI, Quantum, and 6G Technologies at IMS 2026

Rohde & Schwarz to Showcase its Latest RF Test Instrumentation Solutions at IMS 2026

Q versus Bandwidth Chalktalk

CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch, Removing Bottleneck for AI Hardware

Cetecom Advanced Certifies Rohde & Schwarz Test Solution for Hybrid and Next-Generation eCall Testing

Qorvo’s New High-Isolation Switches Reduce Complexity in Multi-Band Radio Designs

MOSIS 2.0 Developer Workshop to Showcase Advanced Semiconductor Prototyping & IC Design at IMS 2026

Pickering to Demonstrate Scalable Switching Solutions and a Design Tool for Faster RF Test Development at IMS 2026