Smiths Interconnect will invest over £2 million into talent acquisition, automation, business development, manufacturing and testing at its Costa Rica facility to support the country’s growing electronics manufacturing sector and anticipate the growing needs of the aerospace, space and defence markets.
YINCAE Advanced Materials Co., Ltd. will exhibit at APEX 2026, March 17–19, at the Anaheim Convention Center in Anaheim, Calif.
At MWC Barcelona 2026, Yokowo and Yonezawa Bussan will jointly present a live V‑Band image‑transmission demonstration featuring the world’s first flexible waveguide, developed using Japan’s traditional kumihimo fiber‑braiding technique, combined with Yokowo’s dedicated compact connector system.
DesignCon has announced the keynote speakers for the 2026 edition.
Amphenol RF introduced new MMCX straight and right-angle plug cable assembly configurations designed on flexible RG-316 cable into their pre-configured cable assembly portfolio.
Ericsson announced a major joint Microsoft-Ericsson development in enterprise mobility — the integration of advanced 5G capabilities directly into Windows 11.
KRYTAR, Inc, announces a new two-way power divider offering high performance over the broadband frequency range of 7.0 to 24.0 GHz in a compact package.
Raytheon was awarded a contract from the Air Force Research Laboratory to develop a domestic production capability for thin film lithium niobate (TFLN) wafers, a material essential to high speed, secure communications and advanced sensing systems.
According to a recently published report from Dell’Oro Group, preliminary findings reveal that the RAN market ended the year on a stable note, with stronger than typical 3Q to 4Q seasonality.
Sivers Semiconductors AB announced general availability of its Cloudchaser beamforming chipset and Maverick antenna-array panels for Ka-Band satcom ground terminals.
The annual RF and Microwave Design Seminar, taking place November 5 at the Møller Institute at Churchill College, features eight high-quality technical presentations from leading industry experts and a small commercial exhibition.
PLD Space and Sateliot have signed a commercial contract to launch their first two high-capacity 5G direct-to-device (D2D) satellites.
Taoglas will introduce the world’s first AI-driven Antenna Product Recommendation Engine at embedded world 2026 in Nuremberg, Germany (March 10-12).