Microwave Journal Magazine

pSemi® Corporation unveiled its latest breakthrough in RF silicon-on-insulator (SOI) platform technology: UltraCMOS+™.

According to a recently published report from Dell’Oro Group, total global revenue for the Broadband Access equipment market decreased to $4.4 B in 1Q 2025, down 8 percent Q/Q but flat year-over-year (Y/Y). 

As the telecommunication standards body 3GPP prepares for setting the scope for Release 20, the Next Generation Mobile Networks Alliance (NGMN) has released a publication advocating the critical need for harmonised global standards for 6G.

Reactel will feature their full line of application specific filters, multiplexers and multifunction assemblies up to 67 GHz at IMS. 

AT&T achieves key network expansion milestone ahead of schedule, solidifying U.S. fiber leadership by reaching even more Americans with world-class fiber internet.

Pixus Technologies has announced its 15th year anniversary as a provider of embedded computing and enclosure solutions.

Qorvo is expanding its satcom portfolio with the launch of a new K-Band PA designed to improve the performance and integration of LEO satellites.

Ericsson and Supermicro have signed a Memorandum of Understanding to explore the combination of Ericsson Enterprise Wireless Solutions’ industry-leading 5G connectivity with Supermicro’s industry-leading Edge AI platforms into commercial bundles.

Sivers Semiconductors announced it has received a purchase order from aiRadar Inc. for the development of a state-of-the-art 28 GHz antenna module based on Sivers’ high performance TRX BF02 beamforming transceiver chip.

Aaronia AG will be presenting the latest solutions for high frequency measurement at IMS2025 in Hall B, Booth 1459.

iNRCORE, LLC announced the launch of its latest innovation, a new range of 1 KW planar transformers designed to meet the demanding needs of military, aerospace, automotive and industrial applications.

Antennex will debut a disruptive new functionality at IMS.

Sumitomo electric Industries, Ltd. and Osaka Metropolitan University have successfully fabricated a GaN transistor on a 2-in. polycrystalline diamond substrate in a joint research project with the Japan Science and Technology Agency. 

Nuvotronics announced the launch of the StrataWorks® platform, a web-based design solution that enables customers to rapidly create and customize PolyStrata®-based passive RF components. 

BAE Systems has been awarded a $1.2 billion contract by U.S. Space Systems Command to provide the U.S. Space Force with missile tracking satellite capabilities.

Filtronic has been awarded a new contract to supply filter and diplexer assemblies to Airbus Defence and Space, supporting the production of additional satellites for Eutelsat OneWeb.

The FAMES Pilot Line announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips.

Keysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications. 

IMFW 2026 announced its call for papers deadline of Oct. 1.